Copper

Electrolytic Copper Anode Oxygen Free

Electrolytic copper plates – ETP copper : made from copper that is more than 99.99% pure, they are used for copper sulphate baths and copper pyrophosphate baths. They are still used for baths containing sodium cyanide or potassium cyanide with copper cyanide.

Oxygen Free copper plates their particularly low oxygen content, always less than 5 ppm, corresponds to special applications. Their advantage is the very low formation of electrolytic sludge compared to electrolytic copper. OF copper is dissolved in copper sulphate acid baths and also formulations with potassium pyrophosphate and copper pyrophosphate. It is also used in baths based on potassium cyanide or sodium cyanide also containing copper cyanide.

Phosphorized copper anode

This slightly alloyed copper quality is used for glossy  copper coatings or as a sub-layer before a nickel layer. Also known as DHP Copper or DXP copper, it contains between 400 and 600 ppm of Phosphor. Anodes are placed in copper sulphate baths.

Uses: copper flat anodes are used for electrolytic copper plating. Depending on the type of copper deposit you want (mat, gloss, ductile, etc.), different copper qualities will be used: electrolytic, Oxygen free or phosphorous.

Copper Balls

copper balls are used for electrolytic copper plating. Depending on the type of copper deposit you want (mat, gloss, ductile, etc.), different copper qualities will be used: Oxygen free or phosphorous.to respond to your needs, we offer several diameters for copper balls ranging from 15 to 60mm, the purity of copper balls is > 99.99%. Made from the purest copper cathodes, the balls are placed in rectangular or cylindrical titanium baskets, depending on their size.

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