Electrolytic Copper Anode Oxygen Free
Electrolytic copper plates – ETP copper : made from copper that is more than 99.99% pure, they are used for copper sulphate baths and copper pyrophosphate baths. They are still used for baths containing sodium cyanide or potassium cyanide with copper cyanide.
Oxygen Free copper plates their particularly low oxygen content, always less than 5 ppm, corresponds to special applications. Their advantage is the very low formation of electrolytic sludge compared to electrolytic copper. OF copper is dissolved in copper sulphate acid baths and also formulations with potassium pyrophosphate and copper pyrophosphate. It is also used in baths based on potassium cyanide or sodium cyanide also containing copper cyanide.
Phosphorized copper anode
This slightly alloyed copper quality is used for glossy copper coatings or as a sub-layer before a nickel layer. Also known as DHP Copper or DXP copper, it contains between 400 and 600 ppm of Phosphor. Anodes are placed in copper sulphate baths.
Uses: copper flat anodes are used for electrolytic copper plating. Depending on the type of copper deposit you want (mat, gloss, ductile, etc.), different copper qualities will be used: electrolytic, Oxygen free or phosphorous.